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Product short description:
  • XMC-SLX150: 147,433 logic cells (XC6SLX150)

Acromag’s cost-effective XMC-SLX modules feature a user-configurable Xilinx® Spartan®-6 FPGA enhanced with high-speed memory and a high-throughput PCIe interface. Field I/O interfaces to the FPGA via the rear J4/P4 connector and/or with optional front mezzanine AXM plug-in I/O modules. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms.

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The logic-optimized FPGA is well-suited for a broad range of applications. Typical uses include hardware simulation, communications, in-circuit diagnostics, military servers, signal intelligence, and image processing.

Large, high-speed memory banks enable efficient data handling. The dual-port SRAM facilitates high-speed DMA transfers to the bus or CPU. A high-bandwidth PCIe interface ensures fast data throughput.

64 I/O lines are accessible through the rear (J4) connector. Additional I/O processing is supported on a separate mezzanine card that plugs into the FPGA base board. A variety of these external AXM I/O cards are available to interface your analog and digital I/O signals.

Take advantage of the conduction-cooled design for use in hostile environments. Conduction efficiently dissipates heat if there is inadequate cooling air flow. Optional extended temperature models operate reliably from -40 to 85°C.

Acromag’s Engineering Design Kit provides software utilities and example VHDL code to simplify your program development and get you running quickly. A JTAG interface enables on-board VHDL debugging.

Performance Specifications
FPGA Device
Xilinx Spartan-6 FPGA: Model XC6SLX150-3FG676 FPGA with 147,433 logic cells and 180 DSP48A1 slices.

FPGA configuration: Download via PCIe bus or flash memory.

Example FPGA program: VHDL provided for bus interface, front & rear I/O control, SRAM read/write interface logic, and SDRAM memory interface controller. See EDK kit.

I/O Processing
Acromag AXM I/O modules: AXM modules plug into the XMC module’s front mezzanine for additional I/O lines. Analog and digital I/O AXM modules are sold separately.

Rear I/O: 64 I/O (32 LVDS) lines supported with a direct connection between the FPGA and the rear I/O connector (J4).

Engineering Design Kit
Provides user with basic information required to develop a custom FPGA program. Kit must be ordered with the first purchase of a XMC-SLX module (see www.acromag.com for more information).

XMC Compliance
Conforms to PCI Express 1.1a electrical and protocol standards. 2.5Gbps data rate per lane per direction.

Complies with ANSI/VITA 42.0 specification for XMC module mechanicals and connectors.

Complies with ANSI/VITA 42.3 specification for XMC modules with PCI Express interface.

Electrical/Mechanical Interface: Single-Width Module.

Environmental
Operating temperature: -0 to 70°C or -40 to 85°C (E versions).

Storage temperature: -55 to 125°C.

Relative humidity: 5 to 95% non-condensing.

Power
3.3V (±5%): 700mA typical, 840mA maximum.
12V (±5%): 640mA typical, 804mA maximum.

MTBF: Contact the factory.

  • Reconfigurable Spartan-6 FPGA with 147,433 logic cells
  • PCIe bus 4-lane Gen 1 interface
  • 256k x 64-bit dual-port SRAM provides direct link from PCIe bus and to FPGA (optional 1M x 64-bit)
  • Supports both front and rear I/O connections
  • 64 I/O or 32 LVDS lines direct to FPGA via rear (J4) connector
  • Plug-in I/O extension modules are available for front mezzanine
  • FPGA code loads from PCIe bus or from flash memory
  • Other memory options available (contact factory)
  • Supports dual DMA channel data transfer to CPU/bus
  • Support for Xilinx ChipScope™ Pro interface
  • Designed for conduction-cooled host card or -40 to 85°C operation in air-cooled systems
  • VPX versions available

Additional information

Weight 16 oz
Dimensions 13 × 12 × 3 in
Part Number

XMC-SLX150: 256 x 64-bit dual-port SRAM, XMC-SLX150E: 256 x 64-bit dual-port SRAM, extended temp., XMC-SLX150-1M: 1M x 64-bit dual-port SRAM, XMC-SLX150E-1M: 1M x 64-bit dual-port SRAM, extended temp.

FPGA Type

Xilinx Spartan-6

Product Series

Kintex-7 Series

Logic Cells

147K

  • Description

    The logic-optimized FPGA is well-suited for a broad range of applications. Typical uses include hardware simulation, communications, in-circuit diagnostics, military servers, signal intelligence, and image processing.

    Large, high-speed memory banks enable efficient data handling. The dual-port SRAM facilitates high-speed DMA transfers to the bus or CPU. A high-bandwidth PCIe interface ensures fast data throughput.

    64 I/O lines are accessible through the rear (J4) connector. Additional I/O processing is supported on a separate mezzanine card that plugs into the FPGA base board. A variety of these external AXM I/O cards are available to interface your analog and digital I/O signals.

    Take advantage of the conduction-cooled design for use in hostile environments. Conduction efficiently dissipates heat if there is inadequate cooling air flow. Optional extended temperature models operate reliably from -40 to 85°C.

    Acromag’s Engineering Design Kit provides software utilities and example VHDL code to simplify your program development and get you running quickly. A JTAG interface enables on-board VHDL debugging.

    Performance Specifications
    FPGA Device
    Xilinx Spartan-6 FPGA: Model XC6SLX150-3FG676 FPGA with 147,433 logic cells and 180 DSP48A1 slices.

    FPGA configuration: Download via PCIe bus or flash memory.

    Example FPGA program: VHDL provided for bus interface, front & rear I/O control, SRAM read/write interface logic, and SDRAM memory interface controller. See EDK kit.

    I/O Processing
    Acromag AXM I/O modules: AXM modules plug into the XMC module’s front mezzanine for additional I/O lines. Analog and digital I/O AXM modules are sold separately.

    Rear I/O: 64 I/O (32 LVDS) lines supported with a direct connection between the FPGA and the rear I/O connector (J4).

    Engineering Design Kit
    Provides user with basic information required to develop a custom FPGA program. Kit must be ordered with the first purchase of a XMC-SLX module (see www.acromag.com for more information).

    XMC Compliance
    Conforms to PCI Express 1.1a electrical and protocol standards. 2.5Gbps data rate per lane per direction.

    Complies with ANSI/VITA 42.0 specification for XMC module mechanicals and connectors.

    Complies with ANSI/VITA 42.3 specification for XMC modules with PCI Express interface.

    Electrical/Mechanical Interface: Single-Width Module.

    Environmental
    Operating temperature: -0 to 70°C or -40 to 85°C (E versions).

    Storage temperature: -55 to 125°C.

    Relative humidity: 5 to 95% non-condensing.

    Power
    3.3V (±5%): 700mA typical, 840mA maximum.
    12V (±5%): 640mA typical, 804mA maximum.

    MTBF: Contact the factory.

  • Features & Benefits

    • Reconfigurable Spartan-6 FPGA with 147,433 logic cells
    • PCIe bus 4-lane Gen 1 interface
    • 256k x 64-bit dual-port SRAM provides direct link from PCIe bus and to FPGA (optional 1M x 64-bit)
    • Supports both front and rear I/O connections
    • 64 I/O or 32 LVDS lines direct to FPGA via rear (J4) connector
    • Plug-in I/O extension modules are available for front mezzanine
    • FPGA code loads from PCIe bus or from flash memory
    • Other memory options available (contact factory)
    • Supports dual DMA channel data transfer to CPU/bus
    • Support for Xilinx ChipScope™ Pro interface
    • Designed for conduction-cooled host card or -40 to 85°C operation in air-cooled systems
    • VPX versions available
  • Specs & Data Sheets

  • Additional information

    Additional information

    Weight 16 oz
    Dimensions 13 × 12 × 3 in
    Part Number

    XMC-SLX150: 256 x 64-bit dual-port SRAM, XMC-SLX150E: 256 x 64-bit dual-port SRAM, extended temp., XMC-SLX150-1M: 1M x 64-bit dual-port SRAM, XMC-SLX150E-1M: 1M x 64-bit dual-port SRAM, extended temp.

    FPGA Type

    Xilinx Spartan-6

    Product Series

    Kintex-7 Series

    Logic Cells

    147K