XMCAP2000: XMC Carrier Card for AcroPack® Modules
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Product short description:
- Two AcroPack or mini-PCIe mezzanine module slots
- Non-Intelligent carrier card
- PCIe x4 interface
This board interfaces two AcroPack mezzanine modules to a PCI Express bus on an air-cooled XMC carrier. Two AcroPack module slots give you the freedom to mix a variety of I/O functions (A/D, D/A, digital in, digital out, serial I/O, etc.) on a single board.
XMCAP2000: XMC Carrier Card for AcroPack® Modules Description
This board interfaces two AcroPack mezzanine modules to a PCI Express bus on an air-cooled XMC carrier.
Two AcroPack module slots give you the freedom to mix a variety of I/O functions (A/D, D/A, digital in, digital out, serial I/O, etc.) on a single board. Or, combine modules of the same type for almost one hundred channels on a single card. Either way, the XMCAP2020/2021 saves your precious card slots and reduces your costs.
Select I/O modules from Acromag’s offering or use most third-party mPCIe compliant modules.
Designed for COTS applications these XMC carrier boards deliver high-reliability and high-performance at a low cost.
AcroPack carriers are RoHS compliant and ideal for military, defense, automation, aerospace, scientific, and development labs industries.
Learn more about the AcroPack Series and view all the models >
XMCAP2000: XMC Carrier Card for AcroPack® Modules Features & Benefits
- Two AcroPack or mini-PCIe module slots support any combination of I/O functions
- PCI Express compliant
- Plug-and-play carrier configuration and interrupt support
- Front panel 68-pin CHAMP 0.8mm connectors for field I/O
- Rear P14 and P16 connectors for field I/O
- DIP switch and/or geographical addressing for card identification
- VITA 42.0, 42.3 complaint
- JTAG programming through XMC P15 connector or through onboard micro connector
- Software development tools for VxWorks, Linux, and Windows environments
Learn more about the AcroPack Series and view all the models >
Specifications
Manuals
Drawings & Diagrams
-
AP-CC-01: Conduction-Cool Kit
- Required for conduction-cooled applications using an AcroPack
Select options -
Termination Products
- DIN rail-mount panels
- 50 screw terminals on 50-pin connector termination panels
- 50 screw terminals on SCSI-2 connector termination panels
- 68 screw terminals on SCSI-3 connector termination panels
Select options
Additional information
| Weight | N/A |
|---|---|
| Dimensions | N/A |
| Part Number | XMCAP2020-LF: front I/O only, XMCAP2021-LF: rear I/O only, XMCAP2022-LF: rear I/O only, for ARCX-4000 applications (consult factory). |
| Product Series | AcroPack Series |
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Description
XMCAP2000: XMC Carrier Card for AcroPack® Modules Description
This board interfaces two AcroPack mezzanine modules to a PCI Express bus on an air-cooled XMC carrier.
Two AcroPack module slots give you the freedom to mix a variety of I/O functions (A/D, D/A, digital in, digital out, serial I/O, etc.) on a single board. Or, combine modules of the same type for almost one hundred channels on a single card. Either way, the XMCAP2020/2021 saves your precious card slots and reduces your costs.
Select I/O modules from Acromag’s offering or use most third-party mPCIe compliant modules.
Designed for COTS applications these XMC carrier boards deliver high-reliability and high-performance at a low cost.
AcroPack carriers are RoHS compliant and ideal for military, defense, automation, aerospace, scientific, and development labs industries.
Learn more about the AcroPack Series and view all the models >
XMCAP2000: XMC Carrier Card for AcroPack® Modules Features & Benefits
- Two AcroPack or mini-PCIe module slots support any combination of I/O functions
- PCI Express compliant
- Plug-and-play carrier configuration and interrupt support
- Front panel 68-pin CHAMP 0.8mm connectors for field I/O
- Rear P14 and P16 connectors for field I/O
- DIP switch and/or geographical addressing for card identification
- VITA 42.0, 42.3 complaint
- JTAG programming through XMC P15 connector or through onboard micro connector
- Software development tools for VxWorks, Linux, and Windows environments
Learn more about the AcroPack Series and view all the models >
-
Tech Papers
What is FPGA Zynq UltraScale+ with MPSoC? - 8401065 (Log in to view the file)APZU FPGA-based digital I/O modules provide programmable Xilinx® Zynq UltraScale+ MPSoC This paper is a brief overview of some of Acromag’s APZU FPGA Zynq® UltraScale+™ with MPSoC products, as well as the features of AcroPack Zinq UltraScale+, the carrier boards that host AcroPack mezzanine modules. We’ll highlight some of the development tools, the engineering design kit, and...What are FPGAs and FPGA Applications? | WebcastFPGAs and Their Use in the Embedded Space What are FPGAs and FPGA Applications in the Embedded Space? Topics in this webcast include: What FPGAs Are Best-suited Applications Coding Methods Processing Types This video is part one of a three-part series in collaboration with Vic Myers Associates discussing the use of FPGAs and their applications. ...How to Use Vivado for FPGA Modifications | WebcastFPGA Design Modifications Using Vivado & Acromag Tools How to Use Vivado for FPGA Modifications. Topics in this webcast include: Vivado 2019.2 Acromag Example Design Compile Project Produce new MCS file This video is part two of a three-part series in collaboration with Vic Myers Associates discussing the use of FPGAs and their applications. ...What is FPGA Zync UltraScale+? | WebcastThese FPGA modules provide a programmable Xilinx Zynq® UltraScale+™ MPSoC What is FPGA Zync UltraScale+? Acromag’s APZU series modules provide a programmable Xilinx Zynq® UltraScale+™ multiprocessor system on a chip (MPSoC). This MPSoC combines a feature-rich ARM-based processing system and programmable logic in a single device. The AcroPack® APZU Mini PCIe FPGA Series is the...How do FPGA Modules Drive Real-Time Applications? - 8400530FPGA Modules with an Integrated Processor Drive Real-Time Applications Engineers developing DSP and high speed logic applications are now well-aware that FPGA modules can help them create an integrated, sophisticated solution. The availability of commercial off-the-shelf (COTS) FPGA boards can make these solutions viable and do so in reduced development times. Today, with systems architected...Migrating from VME to VPX or PCIe: Top 6 Considerations | WebcastIn this webcast several important topics are covered for migrating from VME to VPX or PCIe. This includes the advantages and disadvantages of VME architecture, six key considerations, and an overview of migration to PCIe or VPX (advantages, disadvantages, complexity, performance and cost). More Resources: What is FPGA Zynq UltraScale+ with MPSoC? | Technology... -
Specs & Data Sheets
Specifications
Manuals
Drawings & Diagrams
-
Accessories
-
AP-CC-01: Conduction-Cool Kit
- Required for conduction-cooled applications using an AcroPack
Select options -
Termination Products
- DIN rail-mount panels
- 50 screw terminals on 50-pin connector termination panels
- 50 screw terminals on SCSI-2 connector termination panels
- 68 screw terminals on SCSI-3 connector termination panels
Select options
-
Additional information
Additional information
Weight N/A Dimensions N/A Part Number XMCAP2020-LF: front I/O only, XMCAP2021-LF: rear I/O only, XMCAP2022-LF: rear I/O only, for ARCX-4000 applications (consult factory).
Product Series AcroPack Series
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