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This month we highlight our FPGA I/O extension modules to help simplify your system design. If you missed our live webinar earlier this month, now you can watch our webcast of the recorded webinar at your convenience. We also announce new coporate North American sales managers and have a new blog post from Acromag's President, Dave Wolfe for you.
For more information, call our sales engineers at 877-295-7082 to discuss your application or request a quote.
FPGA Extension Modules Add I/O Processing Flexibility
AXM Series I/O extension modules offer numerous analog and digital I/O options for Acromag’s PMC and XMC modules with configurable FPGAs. These extension modules plug into the front mezzanine on the Virtex-5 and Spartan-6 FPGA modules to provide front-end I/O signal processing. An engineering design version lets you emulate other AXM modules while using Xilinx’s ChipScope tools. Custom I/O configurations can also be developed to meet your unique requirements.
The AXM modules provide front I/O connections to the Xilinx FPGA to simplify your system design and add extra value to Acromag’s PMC and XMC FPGA modules. Virtex-5 models offer powerful FPGA processing with plenty of logic and DSP capacity. Spartan-6 modules are ideal for cost-sensitive projects.
AXM-A30: Two 16-bit 105MHz A/D channels.
AXM-A75: 16 analog inputs, 8 analog outputs, and 16 digital I/O.
AXM-D01: 64 bi-directional LVTTL I/O channels.
AXM-D02: 30 RS485 differential I/O channels.
AXM-D03: 16 CMOS and 22 RS485 differential I/O channels.
AXM-DX03: 16 CMOS and 24 RS485 differential I/O channels.
AXM-D04: 30 LVDS I/O channels.
AXM-EDK: FPGA engineering design kit extension module.
AXM-???: Custom I/O module.
New Webcast: Implementing Embedded Gigabit and 10 Gigabit Ethernet Solutions
Embedded computing system developers are deploying high-speed Ethernet networks in more and more applications to move increasingly large volumes of data and to reduce the complexity of physical interconnects. As a result, new FPGA module processing technologies and communication facilitators, such as TCP offload engines (TOE) like the unified wire silicon stack, are required. These technologies are necessary to meet expanding requirements for data throughput, redundancy, and the exchange of various standardized and non-standardized information. This presentation will discuss the evolution of embedded Ethernet communication technology and explain the benefits and limitations when interfacing data via the SBC, silicon stack hardware and FPGAs.
Acromag's President's blog: Wolfe Tracks
Are Your Signal Conditioners and Isolators ready for Harsh Environments?
Years ago, I was invited to an automotive plant used to stamp body parts from metal sheet stock. It seems that the plant had over 500 temperature transmitters. The transmitters were failing and nobody knew why. They wanted to replace all of them with a new supplier. I was somewhat excited about the opportunity but I did not know what the problem was. The devices were installed in explosion proof housings and the temperature was around 70°F. Not too bad, I thought. When I climbed up on the catwalk to look at one, I realized what the problem was. The large low-inertia motors of the stamping presses were shaking the whole building with a low frequency but steady vibration. After looking at a failed device, I could see a solid core wire that was cracking due to the high vibration. That was the point that I realized how important it was to design equipment for the worst environmental conditions because you can't predict where they will end up. Contine reading
New North Americian Corporate Sales Managers
Acromag is proud to announce that Nathan Harris, email@example.com, is now Acromag's Eastern Regional Sales Manager and Brad Johnson, firstname.lastname@example.org, is Acromag's Western Regional Sales Manager for the Embedded Solutions Division. Nathan and Brad team up with Rowland Demko, email@example.com, to form our North American sales team to provide the best sales support and assistance for CPUs, storage modules, FPGAs and embedded I/O.