XMC-SLX: User-Configurable Spartan-6 FPGA Modules with Plug-In I/O
• XMC-SLX150: 147,433 logic cells (XC6SLX150)
Acromag’s cost-effective XMC-SLX modules feature a user-configurable Xilinx® Spartan®-6 FPGA enhanced with high-speed memory and a high-throughput PCIe interface. Field I/O interfaces to the FPGA via the rear J4/P4 connector and/or with optional front mezzanine AXM plug-in I/O modules. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms.
The logic-optimized FPGA is well-suited for a broad range of applications. Typical uses include hardware simulation, communications, in-circuit diagnostics, military servers, signal intelligence, and image processing.
Large, high-speed memory banks enable efficient data handling. The dual-port SRAM facilitates high-speed DMA transfers to the bus or CPU. A high-bandwidth PCIe interface ensures fast data throughput.
64 I/O lines are accessible through the rear (J4) connector. Additional I/O processing is supported on a separate mezzanine card that plugs into the FPGA base board. A variety of these external AXM I/O cards are available to interface your analog and digital I/O signals.
Take advantage of the conduction-cooled design for use in hostile environments. Conduction efficiently dissipates heat if there is inadequate cooling air flow. Optional extended temperature models operate reliably from -40 to 85°C.
Acromag’s Engineering Design Kit provides software utilities and example VHDL code to simplify your program development and get you running quickly. A JTAG interface enables on-board VHDL debugging.
Xilinx Spartan-6 FPGA: Model XC6SLX150-3FG676 FPGA with 147,433 logic cells and 180 DSP48A1 slices.
FPGA configuration: Download via PCIe bus or flash memory.
Example FPGA program: VHDL provided for bus interface, front & rear I/O control, SRAM read/write interface logic, and SDRAM memory interface controller. See EDK kit.
Acromag AXM I/O modules: AXM modules plug into the XMC module’s front mezzanine for additional I/O lines. Analog and digital I/O AXM modules are sold separately.
Rear I/O: 64 I/O (32 LVDS) lines supported with a direct connection between the FPGA and the rear I/O connector (J4).
Engineering Design Kit
Provides user with basic information required to develop a custom FPGA program. Kit must be ordered with the first purchase of a XMC-SLX module (see www.acromag.com for more information).
Conforms to PCI Express 1.1a electrical and protocol standards. 2.5Gbps data rate per lane per direction.
Complies with ANSI/VITA 42.0 specification for XMC module mechanicals and connectors.
Complies with ANSI/VITA 42.3 specification for XMC modules with PCI Express interface.
Electrical/Mechanical Interface: Single-Width Module.
Operating temperature: -0 to 70°C or -40 to 85°C (E versions).
Storage temperature: -55 to 125°C.
Relative humidity: 5 to 95% non-condensing.
3.3V (±5%): 700mA typical, 840mA maximum.
12V (±5%): 640mA typical, 804mA maximum.
MTBF: Contact the factory.
Features & Benefits
• Reconfigurable Spartan-6 FPGA with 147,433 logic cells
• PCIe bus 4-lane Gen 1 interface
• 256k x 64-bit dual-port SRAM provides direct link from PCIe bus and to FPGA (optional 1M x 64-bit)
• Supports both front and rear I/O connections
• 64 I/O or 32 LVDS lines direct to FPGA via rear (J4) connector
• Plug-in I/O extension modules are available for front mezzanine
• FPGA code loads from PCIe bus or from flash memory
• Other memory options available (contact factory)
• Supports dual DMA channel data transfer to CPU/bus
• Support for Xilinx ChipScope™ Pro interface
• Designed for conduction-cooled host card or -40 to 85°C operation in air-cooled systems
• VPX versions available