APA7-200: Reconfigurable Xilinx® Artix®-7 FPGA Module
• 33,280 logic cells
• PCI Express bus interface
• Conduction or air cooled
APA7-201E-LF: 48 TTL channels
APA7-202E-LF: 24 EIA-485/422 channels
APA7-203E-LF: 24 TTL and 12 EIA-485/422 channels
APA7-204E-LF: 24 LVDS channels
The APA7-200 series provides a FPGA based user-configurable bridge between a host processor and a custom digital interface via PCI Express. These boards feature a best in class Artix®-7 interface to deliver the industry’s lowest power and high performance.
Designed for COTS applications these FPGA based digital I/O modules deliver user-customizable I/O, high-density, high-reliability, and high-performance at a low cost.
The AcroPack® product line updates our popular Industry Pack I/O modules with a PCIe interface format. This tech-refresh design offers a compact size, low-cost I/O, the same functionality as the existing Industry Pack modules and a rugged form factor.
The APA7-200 series modules are 70mm long. This is 19.05mm longer than the full length mini PCIe card at 50.95mm. The boards width is the same as mPCIe board of 30mm and they use the same mPCIe standard board hold down standoff and screw keep out areas.
A down facing 100 pin Samtec connector mates with the carrier card. Fifty of these pins are available for field I/O signals.
The Engineering Design Kit provides users with basic information required to develop custom FPGA firmware for download to the Xilinx FPGA. Example FPGA design code is provided as a Vivado IP Integrator project for functions such as a one-lane PCI Express interface, DMA, digital I/O control register, and more. Users should be fluent in the use of Xilinx Vivado design tools.
FPGA device: Xilinx Artix-7 FPGA Model XC7A35T
FPGA configuration: Download via flash memory
Example FPGA program: IP integrator block diagram provided for PCIe bus 1 lane Gen 1 interface, DMA controller, on chip block RAM, flash memory and control of field I/O. See EDK kit.
Field I/O Interface: PCIe bus 1 lane Gen 1 interface
I/O Connector: 100 pin field I/O connector
Engineering Design Kit
Provides user with basic information required to develop a custom FPGA program. Kit must be ordered with the first purchase of a APA7-200 series module.
PCI Express Base Specification
Conforms to revision 2.0
Lanes: 1 lane in each direction
Bus Speed: 2.5 Gbps (Generation 1)
Memory: 128k space required. 1 base address register.
Air Cooled with heat sink: -40 to 80°C
Air Cooled without heat sink: -40 to 70°C
Conduction Cooled: -40 to 85°C ( A conduction cooled application with an AcroPack requires heatsink model AP-CC-01.)
Storage temperature: -55 to 125°C
Relative humidity: 5 to 95% non-condensing
Power: +3.3V (±5%) 500mA typical
Length: 70mm. Width: 30mm.
Note: AcroPack modules are compatible only with the carriers listed in the accessory section of this page.
Features & Benefits
• PCI Express Generation 1 interface
• Reconfigurable Xilinx® FPGA
• Mix and match countless I/O combinations in a single slot.
• High channel count digital interface: RS485, LVDS and TTL interface options
• 32Mb quad serial Flash memory
• 33,280 logic cells
• 41,600 Flip flops
• 1,800 kb block RAM
• 90 DSP slices
• External LVTTL clock input
• Long distance data transmission
• Example design
• Power up and systemd reset is failsafe
• Conduction-cooled options
• Solid-down connector I/O interface
• Wide temperature range
• VPX and PCIe carriers
• Linux®, Windows®, and VxWorks® support