OpenVPX™ Boards are Rugged and Military Ready – Published in the January 4, 2022 eNewsletter

OpenVPX™ Boards are Rugged and Military Ready

The AcroExpress® 3U and 6U SBC modules can support either one or two DDR4 ECC SODIMMs, for a total of up to 32GB. The SODIMMs are firmly attached to the module with screws and surrounded by heat sink material to provide a mechanically and thermally robust mechanism. Extended temperature models are available for operating in a -40°C to +85°C range.

New High-performance Embedded Computing Options in a Simple, Affordable Package

New High-performance Embedded Computing Options in a Simple, Affordable Package

Acromag introduces a new rugged, small form factor (SFF) embedded computer system with modular I/O for signal processing, communication, and control functions. The ARCX1100 is optimized for size, weight, power, and cost (SWaP-C) with a COM Express Type 10 CPU and four slots for Acromag’s plug-in AcroPack® I/O modules. 

FPGA Modules Your Way. Choose Your Performance Level.

FPGA Modules Your Way. Choose Your Performance Level.

Acromag’s high-performance XMC, PMC and mPCIe-based FPGA modules feature a user-customizable Xilinx® FPGA. These modules allow you to develop and store your own instruction sets in the FPGA for a variety of adaptive computing applications. Select from several models with up to 410K logic cells optimized for logic, DSP, or PowerPC. The high-speed memory and fast bus interfaces rapidly move data.

Representative of the Month: Vic Myers Associates

Representative of the Month: Vic Myers Associates

Vic Myers Associates, is a valued Acromag representative since 2010 for Acromag’s Embedded Computers & I/O Division. Their sales territory covers the states of Arizona, New Mexico, Southern Nevada, Utah, Colorado, Wyoming, Montana, and Eastern Lower Idaho.

VMA is focused on connecting their local customers with their trusted high-technology manufacturing partners by building relationships. 

Contact them at 480-345-6449 for expert assistance.

Published in the January 4, 2022 eNewsletter

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